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Proceedings Paper

Pulsed-laser induced shock wave in fused silica for thin film interfacial testing
Author(s): Junlan Wang
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Paper Abstract

Pulsed-laser induced shock wave development in fused silica is analyzed using nonlinear wave mechanics and applied to thin-film spallation experiments. Due to the negative nonlinear elasticity of fused silica, a laser-induced Gaussian stress pulse evolves into a shock after travelling a certain distance in a fused silica substrate. Experimental observations confirm theoretical predictions of shock development. A decompression shock forms and greatly enhances interfacial failure of a thin film deposited on the substrate. The effectiveness of this wave mechanism is further demonstrated by the successful application in testing ultra-thin low dielectric film/Si substrate interfaces.

Paper Details

Date Published: 21 February 2005
PDF: 10 pages
Proc. SPIE 5647, Laser-Induced Damage in Optical Materials: 2004, (21 February 2005); doi: 10.1117/12.583584
Show Author Affiliations
Junlan Wang, Univ. of California/Riverside (United States)


Published in SPIE Proceedings Vol. 5647:
Laser-Induced Damage in Optical Materials: 2004
Gregory J. Exarhos; Arthur H. Guenther; Norbert Kaiser; Keith L. Lewis; M. J. Soileau; Christopher J. Stolz, Editor(s)

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