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Proceedings Paper

An analytical electrothermal model of a 1D electrothermal MEMS micromirror
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Paper Abstract

We have developed an analytical model that describes the steady-state thermal behavior of a 1-D electrothermal bimorph MEMS micromirror. The steady-state 1-D heat transport equation is used to solve for the temperature distribution of the device upon actuation. Three models are developed using different thermal conditions on the device. The models consider heat dissipation from conduction and convection and the temperature dependence of the actuator electrical resistor. The temperature distribution equation of each model is analyzed to find critical thermal parameters such as the position of maximum temperature, maximum temperature, average temperature, and equivalent thermal resistance. The simplest model, called the Case 1 model, is used to develop an electrothermal lumped element model that uses a single thermal power source. In the Case 1 model, it is shown that a parameter called the “balancing factor” predicts where the maximum temperature is located, the distribution of power flow, and the division of thermal resistances. The analytical models are compared to FEM simulations and agree within 20% for all of the actuation ranges and thermal conditions tested.

Paper Details

Date Published: 28 February 2005
PDF: 10 pages
Proc. SPIE 5649, Smart Structures, Devices, and Systems II, (28 February 2005); doi: 10.1117/12.582136
Show Author Affiliations
Shane T. Todd, Univ. of Florida (United States)
Huikai Xie, Univ. of Florida (United States)


Published in SPIE Proceedings Vol. 5649:
Smart Structures, Devices, and Systems II
Said F. Al-Sarawi, Editor(s)

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