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Proceedings Paper

Modular MEMS design and fabrication for an 80 x 80 transparent optical cross-connect switch
Author(s): Andres Fernandez; Bryan P. Staker; Windsor E. Owens; Lawrence P. Muray; James P. Spallas; William C. Banyai
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Paper Abstract

The ability to transparently switch optical signals from one fiber to another without conversion to the electrical domain is a basic functionality that has a wide range of applications within the fiber optic industry. The so-called 3D-MEMS architecture has emerged as the preferred approach for building transparent, scalable systems with port-counts ranging from 16x16 to 1024x1024. The primary components of the 3D-MEMS architecture are fiber array, lens array, and MEMS mirror array. While a central theme in the MEMS industry is integration, we adopted a strategy of modularization. The key MEMS components, which include mirror array, ceramic substrate, and high-voltage drivers, were manufactured separately and then combined to yield a working product. Central to our modular approach was critical design parameter tolerancing to ensure manufacturability. Results from a large sampling of MEMS components and MEMS assemblies are presented to highlight manufacturability and performance.

Paper Details

Date Published: 25 October 2004
PDF: 10 pages
Proc. SPIE 5604, Optomechatronic Micro/Nano Components, Devices, and Systems, (25 October 2004); doi: 10.1117/12.581901
Show Author Affiliations
Andres Fernandez, Glimmerglass (United States)
Bryan P. Staker, Glimmerglass (United States)
Windsor E. Owens, Glimmerglass (United States)
Lawrence P. Muray, Glimmerglass (United States)
James P. Spallas, Glimmerglass (United States)
William C. Banyai, Glimmerglass (United States)


Published in SPIE Proceedings Vol. 5604:
Optomechatronic Micro/Nano Components, Devices, and Systems
Yoshitada Katagiri, Editor(s)

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