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Proceedings Paper

Hybrid integration technologies for optical micro-systems
Author(s): Eiji Higurashi; T. Itoh; Tadatomo Suga; R. Sawada
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Paper Abstract

Flip-chip bonding of various optical components on a silicon substrate by passive optical alignment, which eliminates complicated optical axis precise alignment, has opened up many new possibilities in constructing highly functional, reliable, and low-cost optical micro-systems. Using this technique several micro-sensors have been developed. Moreover, for future optical micro-systems, a novel method of a low temperature flip-chip bonding using surface activated bonding process has been introduced.

Paper Details

Date Published: 25 October 2004
PDF: 7 pages
Proc. SPIE 5604, Optomechatronic Micro/Nano Components, Devices, and Systems, (25 October 2004); doi: 10.1117/12.580079
Show Author Affiliations
Eiji Higurashi, Univ. of Tokyo (Japan)
T. Itoh, Univ. of Tokyo (Japan)
Tadatomo Suga, Univ. of Tokyo (Japan)
R. Sawada, Kyushu Univ. (Japan)

Published in SPIE Proceedings Vol. 5604:
Optomechatronic Micro/Nano Components, Devices, and Systems
Yoshitada Katagiri, Editor(s)

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