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Proceedings Paper

High-performance and low-thermal time constant amorphous silicon-based 320 x 240 uncooled microbolometer IRFPA
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Paper Abstract

Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. Developments are focused on the improvement of their sensitivity enabling the possibility of reducing the pixel pitch in order to decrease the total system size and weight by using smaller optics. We present the ULIS second generation technology used for producing 320 x 240 (384 x 288) and 160 x 120 IRFPA with a pixel pitch of 35 µm. This enhanced technology was developed by CEA / LETI and has been transferred to ULIS in 2003. The device architecture will be described. This device is well adapted to high volume military applications (i.e. thermal weapons sight, enhanced driver vision) and commercial applications (i.e. predictive maintenance, firefighting, thermography, medical,...) where specifications are the result of a trade-off between pixel pitch, performance and system weight. We have developed for these devices low cost packages. IRFPA electro-optical characterization is presented.

Paper Details

Date Published: 10 January 2005
PDF: 6 pages
Proc. SPIE 5640, Infrared Components and Their Applications, (10 January 2005); doi: 10.1117/12.579876
Show Author Affiliations
Jean-Luc Tissot, ULIS (France)
Jean-Pierre Chatard, ULIS (France)
Bruno Fieque, ULIS (France)
Olivier Legras, ULIS (France)


Published in SPIE Proceedings Vol. 5640:
Infrared Components and Their Applications
Haimei Gong; Yi Cai; Jean-Pierre Chatard, Editor(s)

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