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Proceedings Paper

Aerial-image-based inspection on subresolution scattering bars
Author(s): Luke T.H. Hsu; C. C. Lin; Anja Rosenbusch; Yuval Bloomberg; Simon Kurin
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Paper Abstract

The paper presents the results of a study to define a production-worthy inspection technique for subresolution solid and hollow scattering features used in 193-nm lithography. Masks are inspected using conventional high-NA and aerial-imaging-based mask inspection tools. Inspection results are compared regarding capture rate and nuisance defect rate.

Paper Details

Date Published: 6 December 2004
PDF: 10 pages
Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004); doi: 10.1117/12.579749
Show Author Affiliations
Luke T.H. Hsu, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
C. C. Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Anja Rosenbusch, Etec Systems, Inc., an Applied Materials Co. (Israel)
Yuval Bloomberg, Etec Systems, Inc., an Applied Materials Co. (Israel)
Simon Kurin, Etec Systems, Inc., an Applied Materials Co. (Israel)


Published in SPIE Proceedings Vol. 5567:
24th Annual BACUS Symposium on Photomask Technology
Wolfgang Staud; J. Tracy Weed, Editor(s)

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