Share Email Print
cover

Proceedings Paper

A novel absorptive thin film design for laser welding in optoelectronic device capsulation
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this paper, a kind of absorptive thin film, for the first time, was used in laser welding of SiO2, Si and LiNbO3. This absorptive thin film of three-layer metal-dielectric-metal structure is designed for further reducing the high reflectance of the Nd:YAG laser beam in the surface of the tin layer that is utilized as solder between the transparent parent materials. The actual absorption exceeds 99%. This combination of absorber and solder transformed the laser energy into heat effectively and decreased the minimum necessary incident laser power transmitting through the transparent parent materials. As a result, the damage of the parent materials, which is suffered from laser transmission, is avoided; on the other hand, the laser power is of full utilization and saved.

Paper Details

Date Published: 13 January 2005
PDF: 9 pages
Proc. SPIE 5629, Lasers in Material Processing and Manufacturing II, (13 January 2005); doi: 10.1117/12.579698
Show Author Affiliations
Shaoji Jiang, Zhongshan Univ. (China)
Weiduo Li, Zhongshan Univ. (China)
Hezhou Wang, Zhongshan Univ. (China)


Published in SPIE Proceedings Vol. 5629:
Lasers in Material Processing and Manufacturing II
ShuShen Deng; Akira Matsunawa; Y. Lawrence Yao; Minlin Zhong, Editor(s)

© SPIE. Terms of Use
Back to Top