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Proceedings Paper

Global image placement of LEEPL mask
Author(s): Hideyuki Eguchi; Takashi Susa; Tomoya Sumida; Toshiaki Kurosu; Takashi Yoshii; Kenta Yotsui; Hiroshi Sugimura; Kojiro Itoh; Akira Tamura
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Paper Abstract

Two types of strut-supported low energy electron-beam proximity projection lithography (LEEPL) masks which are grid-type mask and COSMOS-type mask, were investigated for Global image placement (IP). First, we evaluated the dynamic repeatability measurement performance for global IP, measuring a same mask 10 times on a 46 x 46 mm pattern area by using LEEPL electrostatic chuck (ESC). The measurement repeatability for grid type and COSMOS type were 5.1/7.8 nm and 4.4/5.8 nm in x/y directions respectively. And then global in-plane distortion (IPD) of COSMOS type masks with various stress and flatness were measured. The global IPD of a COSMOS-type mask with a low stress of 10 MPa and a flatness of 3.1 μm was 6.5/6.4 nm in x/y directions, which is negligible assuming the measurement repeatability. Finally the global IPs of the two-type masks were measured. The global IPs for the grid-type and COSMOS-type were 24.5/15.7 nm and 23.2/16.4 nm in x/y directions respectively. Thus we confirmed that the global IP obtained meet the required value of less than 30 nm.

Paper Details

Date Published: 6 December 2004
PDF: 8 pages
Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004); doi: 10.1117/12.578655
Show Author Affiliations
Hideyuki Eguchi, Toppan Printing Co., Ltd. (Japan)
Takashi Susa, Toppan Printing Co., Ltd. (Japan)
Tomoya Sumida, Toppan Printing Co., Ltd. (Japan)
Toshiaki Kurosu, Toppan Printing Co., Ltd. (Japan)
Takashi Yoshii, Toppan Printing Co., Ltd. (Japan)
Kenta Yotsui, Toppan Printing Co., Ltd. (Japan)
Hiroshi Sugimura, Toppan Printing Co., Ltd. (Japan)
Kojiro Itoh, Toppan Printing Co., Ltd. (Japan)
Akira Tamura, Toppan Printing Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 5567:
24th Annual BACUS Symposium on Photomask Technology
Wolfgang Staud; J. Tracy Weed, Editor(s)

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