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Proceedings Paper

ArF immersion lithography using TWINSCAN technology
Author(s): Jan Mulkens; Bob Streefkerk; Martin Hoogendorp
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Paper Abstract

For 193-nm lithography, water proves to be a suitable immersion fluid. ArF immersion offers the potential to extend conventional optical lithography to the 45-nm node and potentially to the 32-nm node. Additionally, with existing lenses, the immersion option offers the potential to increase the focus window with 50% and more, depending on actual NA and feature type. In this paper we discuss the results on imaging and overlay obtained with immersion. Using a 0.75 NA ArF projection lens, we have built a proto-type immersion scanner using TWINSCAN technology. First experimental data on imaging demonstrated a large gain of depth of focus (DoF), while maintaining image contrast at high scan speed. For first pilot production with immersion, a 0.85 NA ArF lens will be used. The resolution capabilities of this system will support 65 nm node semiconductor devices with a DOF significantly larger than 0.5 um. Early imaging data of such a system confirms a significant increase in focus window.

Paper Details

Date Published: 27 January 2005
PDF: 12 pages
Proc. SPIE 5645, Advanced Microlithography Technologies, (27 January 2005); doi: 10.1117/12.578071
Show Author Affiliations
Jan Mulkens, ASML Netherlands B.V. (Netherlands)
Bob Streefkerk, ASML Netherlands B.V. (Netherlands)
Martin Hoogendorp, ASML Netherlands B.V. (Netherlands)

Published in SPIE Proceedings Vol. 5645:
Advanced Microlithography Technologies
Yangyuan Wang; Jun-en Yao; Christopher J. Progler, Editor(s)

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