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Proceedings Paper

Hybrid nanocontact printing (HnCP) process technology
Author(s): Jeongdai Jo; Jun-Ho Jeong; Kwang-Young Kim; Eung-Sug Lee; Choon-Gi Choi
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Paper Abstract

The hybrid nanocontact printing(HnCP) method is a technology for manufacturing an ultra violet(UV) imprinted silicon substrate from a master and then printing by letting it get in contact with a substrate coated with a metal thin film. It comprises a step in which a master with a nano-pattern is prepared; a step in which the resist is applied to the surface of the silicon substrate; an imprinting step in which the master is let to get in contact with the resist surface, pressurized and then taken off; a step in which the imprinted silicone substrate is manufactured into a nanocontact stamp by curing the resist on the imprinted silicon substrate; a step of inking a self-assembled monolayer on the surface of the imprinted silicone substrate stamp; a step of transferring a printing pattern by letting the imprinted silicone substrate stamp get in contact with the substrate coated with a metal thin film; and a step of forming a desired pattern on the substrate by etching the metal thin film on the substrate to which the printing pattern has been transferred. In case the HnCP method, on which this study is conducted, is used, it enables the stamp manufacturing process to be shortened and optimized, because the nanoocontact printing process is conducted by using an imprinted silicon substrate stamp, and it has the advantage of making the stamp have a large area so that it is possible to produce it in a large quantity through a mass production process. Also, as a hard stamp is used, any error resulting from an ultra micro torsion and mismatching can be prevented in the multi-layering process, and since any deformation or defect is not brought about, the pattern's resolution can be enhanced so that it is possible to embody a pattern of 100nm.

Paper Details

Date Published: 27 January 2005
PDF: 7 pages
Proc. SPIE 5645, Advanced Microlithography Technologies, (27 January 2005); doi: 10.1117/12.577244
Show Author Affiliations
Jeongdai Jo, Korea Institute of Machinery and Materials (South Korea)
Jun-Ho Jeong, Korea Institute of Machinery and Materials (South Korea)
Kwang-Young Kim, Korea Institute of Machinery and Materials (South Korea)
Eung-Sug Lee, Korea Institute of Machinery and Materials (South Korea)
Choon-Gi Choi, Electronics and Telecommunications Research Institute (South Korea)


Published in SPIE Proceedings Vol. 5645:
Advanced Microlithography Technologies
Yangyuan Wang; Jun-en Yao; Christopher J. Progler, Editor(s)

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