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Proceedings Paper

Design and fabrication of heat sink with impedance matching circuit for high-speed EA modulators
Author(s): Jianbo Tian; Bing Xiong; Lijiang Zhang; Qin Wan; Zhizhi Liu; Jian Wang; Changzheng Sun; Yi Luo
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Paper Abstract

Heat sinks with impedance matching circuit have been designed and fabricated for the packaging of high-speed electroabsorption (EA) modulators. Ti/Cu/Ni/Au metallization system is adopted for the coplanar waveguide (CPW) electrodes and a 50-ohm Ta2N thin-film resistor in parallel with the EA modulator is used for impedance matching. By a matching resistance optimization, a reflection coefficient S11 better than -21 dB has been demonstrated up to 40 GHz. The heat sinks are applied successfully in the 40 GHz Modulator packaging.

Paper Details

Date Published: 17 January 2005
PDF: 7 pages
Proc. SPIE 5644, Optoelectronic Devices and Integration, (17 January 2005); doi: 10.1117/12.575526
Show Author Affiliations
Jianbo Tian, Tsinghua Univ. (China)
Bing Xiong, Tsinghua Univ. (China)
Lijiang Zhang, Tsinghua Univ. (China)
Qin Wan, Tsinghua Univ. (China)
Zhizhi Liu, Tsinghua Univ. (China)
Jian Wang, Tsinghua Univ. (China)
Changzheng Sun, Tsinghua Univ. (China)
Yi Luo, Tsinghua Univ. (China)

Published in SPIE Proceedings Vol. 5644:
Optoelectronic Devices and Integration
Hai Ming; Xuping Zhang; Maggie Yihong Chen, Editor(s)

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