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Proceedings Paper

An experimental research on measuring fracture toughness of high-temperature alloy by holographic moire interferometry
Author(s): Yongqing Gong; Chaohua Yan; Lihua Fang; Min Chen; Daxiang Yu
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Paper Abstract

The fracture toughness of high-temperature alloy material under high-temperature is tested with the laser moire interfrometric device. The zero-thickness grating is etched on the surface of test piece by electrochemical method directly, expanding the research space of high-temperature alloy’s moire interferometry. The moire fringe is collected and analyzed by CCD imaging system of computer, the test result that indicates imaging quality and measurement precision of moire interferometry are improved.

Paper Details

Date Published: 10 February 2005
PDF: 6 pages
Proc. SPIE 5638, Optical Design and Testing II, (10 February 2005); doi: 10.1117/12.575032
Show Author Affiliations
Yongqing Gong, Nanchang Institute of Aeronautical Technology (China)
Chaohua Yan, Nanchang Institute of Aeronautical Technology (China)
Lihua Fang, Nanchang Institute of Aeronautical Technology (China)
Min Chen, Nanchang Institute of Aeronautical Technology (China)
Daxiang Yu, Nanchang Institute of Aeronautical Technology (China)


Published in SPIE Proceedings Vol. 5638:
Optical Design and Testing II
Yongtian Wang; Zhicheng Weng; Shenghua Ye; Jose M. Sasian, Editor(s)

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