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Proceedings Paper

High-resolution computer-aided moire
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Paper Abstract

This paper presents a high resolution computer assisted moiré technique for the measurement of displacements and strains at the microscopic level. The detection of micro-displacements using a moiré grid and the problem associated with the recovery of displacement field from the sampled values of the grid intensity are discussed. A two dimensional Fourier transform method for the extraction of displacements from the image of the moiré grid is outlined. An example of application of the technique to the measurement of strains and stresses in the vicinity of the crack tip in a compact tension specimen is given.

Paper Details

Date Published: 1 December 1991
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Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); doi: 10.1117/12.57486
Show Author Affiliations
Cesar A. Sciammarella, Illinois Institute of Technology (United States)
Gopalakrishna K. Bhat, Illinois Institute of Technology (United States)


Published in SPIE Proceedings Vol. 1554:
Second International Conference on Photomechanics and Speckle Metrology
Fu-Pen Chiang; Fu-Pen Chiang, Editor(s)

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