Share Email Print

Proceedings Paper

Thermal strain measurements of solder joints in electronic packaging using moire interferometry
Author(s): Charls G. Woychik; Yifan Guo
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Thermal strains are the major cause of low cycle fatigue failures of solder interconnections in an electronic package. The strains are created by a coefficient of thermal expansion (CTE) mismatch that occurs between two levels of packaging. As the package approaches smaller dimensions, the measurements of strain concentrations in the solder interconnection become very difficult. In this paper, Moiré interferometry technique was applied to evaluate the thermal strains in the second level interconnections for both conventional pin-in-hole (PIH) packages and surface mount components. The coefficient of thermal expansion of each component was measured. The thermal strains distributions in the solder interconnections (typical dimensions are 10 - 100 micrometers) were determined, and the reliability issues were discussed. The strains in solder joints of the PIH components were much higher than those of the stacked surface mount component. Even though the surface mount component had a lower inherent strength, the overall mechanical reliability was much higher since there were practically no localized strain concentrations.

Paper Details

Date Published: 1 December 1991
Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); doi: 10.1117/12.57472
Show Author Affiliations
Charls G. Woychik, IBM Corp. (United States)
Yifan Guo, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 1554:
Second International Conference on Photomechanics and Speckle Metrology
Fu-Pen Chiang; Fu-Pen Chiang, Editor(s)

© SPIE. Terms of Use
Back to Top