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Proceedings Paper

Determination of thermal stresses in a bimaterial specimen by moire interferometry
Author(s): Yilan Kang; Youquan Jia; Ji Du
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Paper Abstract

The thermal deformation and stresses of a bimaterial specimen were determined by high sensitive moiré interferometry. A thermal replicate method was developed in which the thermally deformed specimen grating was replicated to a non-thermal expansion glass plate at elevated temperature and viewed at a moiré intermerometer after it was cooled. The carrier fringe technique was used to separate the free thermal expansion and the thermal stress-induced deformation. Based on the test results the thermal strains and stresses around the interface and the stress concentration at the inner corner of the bimaterial specimen were discussed.

Paper Details

Date Published: 1 December 1991
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Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); doi: 10.1117/12.57435
Show Author Affiliations
Yilan Kang, Tianjin Univ. (China)
Youquan Jia, Tianjin Univ. (China)
Ji Du, Tianjin Univ. (China)


Published in SPIE Proceedings Vol. 1554:
Second International Conference on Photomechanics and Speckle Metrology
Fu-Pen Chiang; Fu-Pen Chiang, Editor(s)

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