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Proceedings Paper

Interferometric moire analysis of wood and paper structures
Author(s): James B. Hyzer; Jim Shih; Robert E. Rowlands
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Paper Abstract

Moiré interferometry was used here to determine fundamental engineering information of cellulosic (wood, paper) structures. Cyclic creep and fracture behavior of paperboard, and the displacements (strains) in bolted connectors in wood were analyzed with up to 61,000 ℓpi moiré interferometry.

Paper Details

Date Published: 1 December 1991
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Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); doi: 10.1117/12.57421
Show Author Affiliations
James B. Hyzer, J. B. Hyzer Associates (United States)
Jim Shih, Univ. of Wisconsin/Madison (United States)
Robert E. Rowlands, Univ. of Wisconsin/Madison (United States)


Published in SPIE Proceedings Vol. 1554:
Second International Conference on Photomechanics and Speckle Metrology
Fu-Pen Chiang; Fu-Pen Chiang, Editor(s)

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