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Proceedings Paper

Solid state UV laser technology for electronic packaging applications
Author(s): Weisheng Lei; John Davignon
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Paper Abstract

This presentation introduces solid state UV laser drilling technology for electronic packaging applications which mainly includes generating microvias in high-density interconnects (HDI) printed wiring boards (PWB) and integrated circuit (IC) chip packaging devices. The first three sections discuss the drilling process technology in terms of substrate materials, via quality requirements, laser-materials interaction, via formation processes, laser beam profiles, and system hardware. The remaining sections cover some typical application examples including via drilling, soldermask ablation, and routing to explain the UV laser process capability with the common PWB materials.

Paper Details

Date Published: 13 January 2005
PDF: 13 pages
Proc. SPIE 5629, Lasers in Material Processing and Manufacturing II, (13 January 2005); doi: 10.1117/12.571520
Show Author Affiliations
Weisheng Lei, Electro Scientific Industry, Inc. (United States)
John Davignon, Electro Scientific Industry, Inc. (United States)


Published in SPIE Proceedings Vol. 5629:
Lasers in Material Processing and Manufacturing II
ShuShen Deng; Akira Matsunawa; Y. Lawrence Yao; Minlin Zhong, Editor(s)

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