Share Email Print
cover

Proceedings Paper

Integrating RET and mask manufacturability in designs for local interconnect for sub-100-nm trenches
Author(s): Nishrin Kachwala; Travis E. Brist; Rick S. Farnbach
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Model based OPC for low k1 lithography has a large impact on mask cost, and hence must be optimized with respect to mask manufacturability and mask cost without sacrificing device performance. Design IP blocks not designed with the lithography process in mind (not "litho friendly") require more complex RET/OPC solutions, which can in turn result in unnecessary increases in the mask cost and turn around time. These blocks are typically replicated many times across a design and can therefore have a compounding effect. Design for manufacturing (DFM) techniques verify and alleviate complex interactions between design and process. DFM can be applied at various stages in your design-to-silicon flow. We will discuss how these DFM methods are applied and implemented at Cypress. We will also show how design rules are defined and present several methods for injecting OPC/RET awareness into the designs prior to mask manufacture.

Paper Details

Date Published: 6 December 2004
PDF: 9 pages
Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004); doi: 10.1117/12.569848
Show Author Affiliations
Nishrin Kachwala, Cypress Semiconductor Corp. (United States)
Travis E. Brist, Mentor Graphics Corp. (United States)
Rick S. Farnbach, Mentor Graphics Corp. (United States)


Published in SPIE Proceedings Vol. 5567:
24th Annual BACUS Symposium on Photomask Technology
Wolfgang Staud; J. Tracy Weed, Editor(s)

© SPIE. Terms of Use
Back to Top