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Proceedings Paper

Evaluation of the mechanical properties of square membranes prestressed by PECVD silicon oxynitride thin films
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Paper Abstract

A very broad field of relevant technologies and testing methods for silicon micromechanical elements had to be limited to specific elements and adapted methodologies including experimental and numerical methods. In particular, the bimorph micromembranes under buckling are key elements for investigations of their mechanical properties. Due to optical quality of silicon-based layers deposited on micromechanical devices under consideration, the two-beam interferometry with computer interferogram processing is well adapted for shape and deformation measuring, while the nanoindentation is able to extract the hardness as well as the Young’s modulus. In this contribution, we investigate the silicon square membranes prestressed by deposition of silicon oxinitride (SiOxNy) films fabricated by PECVD. The combination of experimental techniques with fine elements method (FEM) proposed here offers a powerful tools for investigation of residual stress of SiOxNy layers. The distribution of residual stress is monitored as a function of the refractive index of SiOxNy films, establishing the correlation between the optical and micromechanical properties of deposited thin films.

Paper Details

Date Published: 2 August 2004
PDF: 6 pages
Proc. SPIE 5532, Interferometry XII: Applications, (2 August 2004); doi: 10.1117/12.569806
Show Author Affiliations
Michal Jozwik, Warsaw Univ. of Technology (Poland)
Univ. de Franche-Comte (France)
Christophe Gorecki, Univ. de Franche-Comte (France)
Patrick Delobelle, Univ. de Franche-Comte (France)
Andrei Sabac, Univ. de Franche-Comte (France)
Malgorzata Kujawinska, Warsaw Univ. of Technology (Poland)


Published in SPIE Proceedings Vol. 5532:
Interferometry XII: Applications
Wolfgang Osten; Erik Novak, Editor(s)

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