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Proceedings Paper

Qualifying OPC model robustness to reticle noise errors and FAB process changes
Author(s): Diane M. Keil; Nadya Belova; John V. Jensen; Neal P. Callan
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Paper Abstract

A methodology has been developed to measure OPC model robustness as a function of systematic and statistical process variations. The analysis includes comparison of imaging solutions with several different OPC models generated for different writing tools and lithography process conditions. This approach allows for definition of OPC model tolerance in the continually changing R&D and production environment. The question of when it is absolutely necessary to regenerate OPC models and when application of "the old" OPC model is acceptable is answered This method has been applied at LSI Logic for qualifying a single OPC model for e-beam and laser reticle writing tools in back-end processes for the 0.13um technology node. The OPC model tolerance qualification takes additional time and engineering effort, but it provides pay back through comparable or better product performance and lower costs.

Paper Details

Date Published: 6 December 2004
PDF: 12 pages
Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004); doi: 10.1117/12.569580
Show Author Affiliations
Diane M. Keil, LSI Logic Corp. (United States)
Portland State Univ. (United States)
Nadya Belova, LSI Logic Corp. (United States)
John V. Jensen, LSI Logic Corp. (United States)
Neal P. Callan, LSI Logic Corp. (United States)


Published in SPIE Proceedings Vol. 5567:
24th Annual BACUS Symposium on Photomask Technology
Wolfgang Staud; J. Tracy Weed, Editor(s)

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