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Proceedings Paper

How to etch the optimal silicon trench: profile development and process discussion
Author(s): Wolfgang Pilz; K. Graendorff; Joachim Janes; Joachim Pelka
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Paper Details

Date Published: 1 February 1992
PDF: 8 pages
Proc. SPIE 1593, Dry Etch Technology, (1 February 1992); doi: 10.1117/12.56931
Show Author Affiliations
Wolfgang Pilz, Fraunhofer-Institut fuer Mikrostrukturtechnik (Germany)
K. Graendorff, Fraunhofer-Institut fuer Mikrostrukturtechnik (Germany)
Joachim Janes, Fraunhofer-Institut fuer Mikrostrukturtechnik (Germany)
Joachim Pelka, Fraunhofer-Institut fuer Mikrostrukturtechnik (Germany)


Published in SPIE Proceedings Vol. 1593:
Dry Etch Technology
Deepak Ranadive, Editor(s)

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