Share Email Print
cover

Proceedings Paper

Design, mask, and manufacturability
Author(s): Mark Ma; Hyesook Hong; Yong Seok Choi; Chi-Chien Ho; Mark Mason; Randy McKee
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The ability to transfer designs with high fidelity onto photomasks and then to silicon is an increasingly complex task for advanced technology nodes. For example, the majority of the critical layers for even the 130nm node are patterned by sub-wavelength photolithography; therefore, the numerical aperture, illumination condition, and the resist process must be optimized to achieve the necessary resolution. The reticle, as a bridge between design and process, has become very complex due to the extensive application of resolution enhancement technologies (RETs). As the complexity of RETs increases, the final mask data can be vastly different from the original design due to a series of data manipulations. Optimizing the reticle layout plays the pivotal role in design-for-manufacturability (DFM) considerations. In this paper, we will discuss how design rules must accommodate the needs of Optical Proximity Correction (OPC) and Phase-shifting Masks (PSM). The final layout on a mask after extensive polygon manipulation must also meet the capability and manufacturability of mask writing, mask inspection, and silicon processing. We will also discuss how the wafer fab's perspective can affect the mask shop. Throughout the discussion, we will demonstrate that the integration at mask level and the collaboration of design, RET, mask shop, and wafer fab are key to DFM success.

Paper Details

Date Published: 6 December 2004
PDF: 10 pages
Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004); doi: 10.1117/12.569309
Show Author Affiliations
Mark Ma, Texas Instruments Inc. (United States)
Hyesook Hong, Texas Instruments Inc. (United States)
Yong Seok Choi, Texas Instruments Inc. (United States)
Chi-Chien Ho, Texas Instruments Inc. (United States)
Mark Mason, Texas Instruments Inc. (United States)
Randy McKee, Texas Instruments Inc. (United States)


Published in SPIE Proceedings Vol. 5567:
24th Annual BACUS Symposium on Photomask Technology
Wolfgang Staud; J. Tracy Weed, Editor(s)

© SPIE. Terms of Use
Back to Top