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Proceedings Paper

Protection of aluminum alloy films from after corrosion using H2O down stream ashing
Author(s): Fukashi Harada; T. Kondo; J. Konno; Shuzo Fujimura; K. Shinagawa; T. Takada
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Paper Abstract

While miniatuarization of semiconductors has enabled aluminum wiring pattern dimensions smaller and smaller, this has also given rise to problems such as stress migration and electromigration. The use of copper reportedly suppreses such migration.

Paper Details

Date Published: 1 February 1992
PDF: 6 pages
Proc. SPIE 1593, Dry Etch Technology, (1 February 1992); doi: 10.1117/12.56930
Show Author Affiliations
Fukashi Harada, Fujitsu Ltd. (Japan)
T. Kondo, Fujitsu Ltd. (Japan)
J. Konno, Fujitsu Ltd. (Japan)
Shuzo Fujimura, Fujitsu Ltd. (Japan)
K. Shinagawa, Fujitsu Ltd. (Japan)
T. Takada, Fujitsu Ltd. (Japan)

Published in SPIE Proceedings Vol. 1593:
Dry Etch Technology
Deepak Ranadive, Editor(s)

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