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Proceedings Paper

Application-specific integrated processing for ULSI
Author(s): James E. Nulty; Joseph A. Maher
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Paper Abstract

ULSI device manufacturing requires capital equipment manufacturers to deliver state of the art performance, particle-free process environments, and high uptime. With critical dimensions of 0.5 ? and below, essentially perfect etching results are required to meet device requirements. Gate structures, once simple poly-si types, are now multiple films of poly-si plus silicide. Contact hole etching to silicon requires damage free and polymer free surfaces following etch. Metallizations, once single aluminum alloy films, are now complex refractory metal/aluminum/refractory metal sandwiches. Multiple etch steps are required to successfully process these layers. Drytek has manufactured integrated process equipment for the past six years. To meet the demand for ULSI, Drytek has developed the ASIQ™, or Application Specific Integrated Quad. Our paper will discuss the benefits of the ASIQ™ system concept for complex etch applications, where the use of different plasma sources on the same integrated process platform is required for near perfect etching results of ULSI devices.

Paper Details

Date Published: 1 February 1992
PDF: 8 pages
Proc. SPIE 1593, Dry Etch Technology, (1 February 1992); doi: 10.1117/12.56920
Show Author Affiliations
James E. Nulty, Drytek (United States)
Joseph A. Maher, Drytek (United States)


Published in SPIE Proceedings Vol. 1593:
Dry Etch Technology
Deepak Ranadive, Editor(s)

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