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Proceedings Paper

EUV mask pilot line at Intel Corporation
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Paper Abstract

The introduction of extreme ultraviolet (EUV) lithography into high volume manufacturing requires the development of a new mask technology. In support of this, Intel Corporation has established a pilot line devoted to encountering and eliminating barriers to manufacturability of EUV masks. It concentrates on EUV-specific process modules and makes use of the captive standard photomask fabrication capability of Intel Corporation. The goal of the pilot line is to accelerate EUV mask development to intersect the 32nm technology node. This requires EUV mask technology to be comparable to standard photomask technology by the beginning of the silicon wafer process development phase for that technology node. The pilot line embodies Intel's strategy to lead EUV mask development in the areas of the mask patterning process, mask fabrication tools, the starting material (blanks) and the understanding of process interdependencies. The patterning process includes all steps from blank defect inspection through final pattern inspection and repair. We have specified and ordered the EUV-specific tools and most will be installed in 2004. We have worked with International Sematech and others to provide for the next generation of EUV-specific mask tools. Our process of record is run repeatedly to ensure its robustness. This primes the supply chain and collects information needed for blank improvement.

Paper Details

Date Published: 6 December 2004
PDF: 10 pages
Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004); doi: 10.1117/12.569176
Show Author Affiliations
Alan R. Stivers, Intel Corp. (United States)
Pei-Yang Yan, Intel Corp. (United States)
Guojing Zhang, Intel Corp. (United States)
Ted Liang, Intel Corp. (United States)
Emily Y. Shu, Intel Corp. (United States)
Edita Tejnil, Intel Corp. (United States)
Barry Lieberman, Intel Corp. (United States)
Rajesh Nagpal, Intel Corp. (United States)
Kangmin Hsia, Intel Corp. (United States)
Michael Penn, Intel Corp. (United States)
Fu-Chang Lo, Intel Corp. (United States)


Published in SPIE Proceedings Vol. 5567:
24th Annual BACUS Symposium on Photomask Technology
Wolfgang Staud; J. Tracy Weed, Editor(s)

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