Share Email Print
cover

Proceedings Paper

Mask topography effect in chromeless phase lithography
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Different types of phase-shift masks (PSM) in combination with the proper illumination condition are widely used to allow 193nm lithography to print ever-decreasing pitches with a sufficient process window. A viable option for the 65nm node is Chromeless Phase Lithography (CPL), which combines a chromeless phase shift mask and 193nm off-axis illumination. It has been demonstrated that CPL has a high flexibility for through pitch imaging. Also concerning mask making CPL masks showed advantages over alternating and attenuated PSM [1]. This paper discusses how the mask quality and its topography influence the imaging performance of CPL. It is shown that mask topography is an important factor for CPL, as the imaging relies also on the quartz depth differences in the mask. The wafer image is sensitive to phase variations induced by the quartz etch depth and the sidewall profile. Their impact is separately studied using rigorous 3D mask electro-magnetic field simulations (Sigma-C Solid-CM). Correlation of experimental results to simulation explains that the observed pitch-dependent tilt in the Bossung curves is mainly related to the 3D character of the mask. In search for a global compensation valid through pitch, the simulation study also evaluates the effect of other contributors such as lens aberrations in the optical system, assist features and half-toning Cr zebra lines in the design. However, as the tilt is inherent to the CPL mask fabrication, a compensation of the Bossung tilt effect can only be obtained for specific combinations of all sources, as will be shown. We concentrate on the imaging of 70nm lines and 100nm contact holes in pitches ranging from dense up to isolated. The wafers are exposed on an ASML PAS5500/1100 ArF scanner working with a 0.75NA projection lens and various types of off-axis illumination. The wafers are evaluated on a top-down CD SEM (KLA-Tencor 8250XR).

Paper Details

Date Published: 6 December 2004
PDF: 11 pages
Proc. SPIE 5567, 24th Annual BACUS Symposium on Photomask Technology, (6 December 2004); doi: 10.1117/12.568694
Show Author Affiliations
Vicky Philipsen, IMEC vzw (Belgium)
Joost Bekaert, IMEC vzw (Belgium)
Geert Vandenberghe, IMEC vzw (Belgium)
Rik Jonckheere, IMEC vzw (Belgium)
Douglas Van Den Broeke, ASML MaskTools, Inc. (United States)
Robert Socha, ASML Technology Development Ctr. (United States)


Published in SPIE Proceedings Vol. 5567:
24th Annual BACUS Symposium on Photomask Technology
Wolfgang Staud; J. Tracy Weed, Editor(s)

© SPIE. Terms of Use
Back to Top