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Proceedings Paper

Low-cost and highly reliable optoelectronic devices for 10-Gb/s ethernet applications
Author(s): Cheng-Hung Tsai; Shin-Ge Lee; Chen-Kun Chen; Chih-Hao Hsu; Chun-Sheng Lee; Kun-Yi Shen; Shou-Chien Cheng; Chun-Hsing Lee; Fu-Yi Cheng; Min-Fa Huang; Cheng-Da Shaw; Yu-Chen Yu; Mu-Tao Chu
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Paper Abstract

With the drastic expansion of internet usage, the demand of 10Gbps transmission optoelectronic devices for local-area-network (LAN) and storage-area-network (SAN) are increasing. The key issues of these applications are to improve cost, manufacturability and reliability of optoelectronic devices in high speed transmission. The authors have demonstrated highly manufacturable and reliable optical front end and trasneiver module for 10Gbps Ethernet applications in this paper. TO-Can package is a way to reduce cost of 10Gbps optical assembly. However, the signal integrity of high speed transmitter optical sub-assembly (TOSA) and receiver optical sub-assembly (ROSA) are limited due to the mismatched characteristic impedance, parasitic inductance and spread capacitance of conventional TO-Can package. In this paper, high performance and high sensitivity of 10Gbps TOSA and ROSA with TO-Can package are discussed and demonstrated to overcome the critical issues mentioned, respectively. In order to improve the signal integrity and manufacturability of 10Gbps OSA in 10Gigabit Ethernet small form factor transceiver module assembly. The authors also integrate high speed flex board and OSA package to extend the signal path, and to minimize the effect of crosstalk in module. The high speed transceiver modules with TO-Can package embedded compliant with XFP multi-source agreement (MSA) are also demonstrated in this paper. The performance of temperature-stabilized transceiver module over awide case temperature range is tested. The optical eye diagram of 10Gbps transmitter developed in this study shows an excellent quality passing the 10Gbps Ethernet mask test between 0 degrees Centigrade and to 70 degrees Centigrade. Finally, the reliability tests regulated by Telcordia GR-468-CORE and MIL-STD-883 are also performed and certified to pave the ways of highly manufacturable and reliable XFP transceiver modules for 10Gbps Ethernet applications.

Paper Details

Date Published: 25 October 2004
PDF: 12 pages
Proc. SPIE 5595, Active and Passive Optical Components for WDM Communications IV, (25 October 2004); doi: 10.1117/12.568517
Show Author Affiliations
Cheng-Hung Tsai, Industrial Technology Research Institute (Taiwan)
Shin-Ge Lee, Industrial Technology Research Institute (Taiwan)
Chen-Kun Chen, Industrial Technology Research Institute (Taiwan)
Chih-Hao Hsu, Industrial Technology Research Institute (Taiwan)
Chun-Sheng Lee, Industrial Technology Research Institute (Taiwan)
Kun-Yi Shen, Industrial Technology Research Institute (Taiwan)
Shou-Chien Cheng, Industrial Technology Research Institute (Taiwan)
Chun-Hsing Lee, Industrial Technology Research Institute (Taiwan)
Fu-Yi Cheng, Industrial Technology Research Institute (Taiwan)
Min-Fa Huang, Industrial Technology Research Institute (Taiwan)
Cheng-Da Shaw, Industrial Technology Research Institute (Taiwan)
Yu-Chen Yu, Industrial Technology Research Institute (Taiwan)
Mu-Tao Chu, Industrial Technology Research Institute (Taiwan)


Published in SPIE Proceedings Vol. 5595:
Active and Passive Optical Components for WDM Communications IV
Achyut Kumar Dutta; Abdul Ahad Sami Awwal; Niloy K. Dutta; Yasutake Ohishi, Editor(s)

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