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Proceedings Paper

Biopsy applications of Ti50Ni41Cu9 shape memory films for wireless capsule endoscope
Author(s): Hejun Du; Yongqing Fu; S. Zhang; Jack K. Luo; Andrew J. Flewitt; William I. Milne
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Paper Abstract

Wireless capsule endoscopy (WCE) is a new technology to evaluate the patient with obscure gastrointestinal bleeding. However, there is still some deficiency existing in the current WCE, for example, lack of ability to biopsy and precisely locate the pathology. This study aimed to prepare and characterize TiNiCu shape memory alloy thin films for developing microgripper for biopsy (tissue sampling and tagging) applications. Ti50Ni41Cu9 thin films were prepared by co-sputtering of TiNi and Cu targets, and their transformation temperatures were slightly above that of human body. Results from differential scanning calorimetry, in-situ X-ray diffraction, curvature and electrical resistance measurement revealed clearly martensitic transformation of the deposited TiNiCu films upon heating and cooling. The biocompatibility of the TiNiCu films in the simulated gastric and intestinal solutions was also studied. Results showed the release of Ni and Cu ions is much less than the toxic level and the film did not lose shape memory effect even after 10-day immersion in the simulated solutions. TiNiCu/Si micro-cantilevers with and without electrodes were fabricated using the conventional micromachining methods and apparent shape memory effect upon heating and cooling was demonstrated.

Paper Details

Date Published: 16 February 2004
PDF: 10 pages
Proc. SPIE 5648, Smart Materials III, (16 February 2004); doi: 10.1117/12.568176
Show Author Affiliations
Hejun Du, Singapore-Massachusetts Institute of Technology Alliance (Singapore)
Nanyang Technological Univ. (Singapore)
Yongqing Fu, Singapore-Massachusetts Institute of Technology Alliance (Singapore)
Cambridge Univ. (United Kingdom)
S. Zhang, Nanyang Technological Univ. (Singapore)
Jack K. Luo, Univ. of Cambridge (United Kingdom)
Andrew J. Flewitt, Univ. of Cambridge (United Kingdom)
William I. Milne, Univ. of Cambridge (United Kingdom)


Published in SPIE Proceedings Vol. 5648:
Smart Materials III
Alan R. Wilson, Editor(s)

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