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Proceedings Paper

Production challenges of making an EUV mask blank
Author(s): Lutz Aschke; Hans W. Becker; Falk Friemel; Thomas Leutbecher; Nathalie Olschewski; Markus Renno; Frauke Rueggeberg; Mario Schiffler; Frank Schmidt; Frank Sobel; Kurt Walter; Guenter Hess; Frank Lenzen; Konrad Knapp; Jochen Alkemper; Hrabanus Hack; Klaus Megges; Ina Mitra; Rolf Mueller; Uwe Nolte; Joerg Schumacher; Wolfgang Pannhorst
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Paper Abstract

Mask Blanks for EUV Lithography require a lot of new properties and features compared to standard COG blanks. Starting from completely new low thermal expansion substrate materials with significantly improved surface quality over multilayer coatings for EUV reflection, buffer layers, up to new absorber layers with improved dry etching and inspection properties. This paper introduces in the special features of Low Thermal Expansion Materials (LTEM), their manufacturing and the special metrology for the Coefficient of Thermal Expansion (CTE). We will look into some details of polishing methods for much better flatness of the substrates. The process and the metrology of low defect EUV multilayer coatings will be elucidated and some aspects of this will be explained in detail. In addition we will present new results from no-chrome alternative absorber materials.

Paper Details

Date Published: 2 June 2004
PDF: 11 pages
Proc. SPIE 5504, 20th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (2 June 2004); doi: 10.1117/12.568007
Show Author Affiliations
Lutz Aschke, Schott Lithotec AG (Germany)
Hans W. Becker, Schott Lithotec AG (Germany)
Falk Friemel, Schott Lithotec AG (Germany)
Thomas Leutbecher, Schott Lithotec AG (Germany)
Nathalie Olschewski, Schott Lithotec AG (Germany)
Markus Renno, Schott Lithotec AG (Germany)
Frauke Rueggeberg, Schott Lithotec AG (Germany)
Mario Schiffler, Schott Lithotec AG (Germany)
Frank Schmidt, Schott Lithotec AG (Germany)
Frank Sobel, Schott Lithotec AG (Germany)
Kurt Walter, Schott Lithotec AG (Germany)
Guenter Hess, Schott Lithotec AG (Germany)
Frank Lenzen, Schott Lithotec AG (Germany)
Konrad Knapp, Schott Lithotec AG (Germany)
Jochen Alkemper, Schott Glas (Germany)
Hrabanus Hack, Schott Glas (Germany)
Klaus Megges, Schott Glas (Germany)
Ina Mitra, Schott Glas (Germany)
Rolf Mueller, Schott Glas (Germany)
Uwe Nolte, Schott Glas (Germany)
Joerg Schumacher, Schott Glas (Germany)
Wolfgang Pannhorst, Schott Glas (Germany)

Published in SPIE Proceedings Vol. 5504:
20th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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