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Proceedings Paper

Hard pellicle investigation for 157-nm lithography: impact on overlay
Author(s): Richard Bruls; Tammo Uitterdijk; Orlando Cicilia; Peter De Bisschop; Michael K. Kocsis; Andrew Grenville; Chris K. Van Peski; Roxann L. Engelstad; Jaehyuk Chang; Eric P. Cotte; Kaname Okada; Kazushige Ohta; Hitoshi Mishiro; Shinya Kikugawa
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Paper Abstract

For 157 nm lithography the pellicle material will be most probably a 800 μm thick inorganic (fluorine doped fused silica) plate instead of a standard thin (~ 1 μm) organic (polymer) film. The thickness of the pellicle makes it an additional optical element in the 157 nm exposure tool. This puts tight requirements on the optical properties of the pellicle. One of the largest challenges is to control the pellicle induced overlay errors that result from small variations in pellicle flatness. A local tilt of 12 μrad already introduces an image displacement of 1 nm. This paper deals with the theoretical understanding of the pellicle indued overlay errors. It shows the relation between offline pellicle flatness measurements and exposure tool overlay performance. Two potential solutions are presented to obtain the pellicle within the desired overlay specification. System overlay corrections in combination with a new mounting strategy based on 'correctable pellicle shapes' seem to make the desired overlay specification (≤ 1 nm) feasible. The proposed 'one-dimensional' pellicle shape seems to be very promising. Distortion data, as obtained from exposures on a 193 nm system with and without pellicle, indicate that the proposed solution for automatically and fully correcting for a non-flat pellicle is feasible.

Paper Details

Date Published: 2 June 2004
PDF: 11 pages
Proc. SPIE 5504, 20th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (2 June 2004); doi: 10.1117/12.568003
Show Author Affiliations
Richard Bruls, ASML (Netherlands)
Tammo Uitterdijk, ASML (Netherlands)
Orlando Cicilia, ASML (Netherlands)
Peter De Bisschop, IMEC (Belgium)
Michael K. Kocsis, Intel Corp./International SEMATECH (United States)
Andrew Grenville, Intel Corp./International SEMATECH (United States)
Chris K. Van Peski, International SEMATECH (United States)
Roxann L. Engelstad, Univ. of Wisconsin/Madison (United States)
Jaehyuk Chang, Univ. of Wisconsin/Madison (United States)
Eric P. Cotte, Univ. of Wisconsin/Madison (United States)
Kaname Okada, Asahi Glass Co., Ltd. (Japan)
Kazushige Ohta, Asahi Glass Co., Ltd. (Japan)
Hitoshi Mishiro, Asahi Glass Co., Ltd. (Japan)
Shinya Kikugawa, Asahi Glass Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 5504:
20th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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