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Proceedings Paper

Wafer emissivity correction using dual-color pyrometry
Author(s): David Mordo; Yuval Wasserman; Arnon Gat
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Paper Abstract

A novel dual color pyrometry method forcorrecting wafer-to-waferemissivity changes during rapid thermal processing (RiP) is discussed. This new technique, using a system called TRAC (Temperature Repeatability with Automatic Control) addresses a key issue affecting the reproducibility of RTP production applications: accurate temperature measurement and control. The effect of this new emissivity correction method on reproducibility ofrapid thermal oxidation (RTO) and ion implant rapid thermal activation (RTA) of wafers with varying emissivities is presented. The results demonstrate significant improvement oftemperature control and temperature repeatability from wafer-to-wafer both for RTO and short RTA processes when in situ emissivity correction is applied.

Paper Details

Date Published: 1 February 1992
PDF: 9 pages
Proc. SPIE 1595, Rapid Thermal and Integrated Processing, (1 February 1992); doi: 10.1117/12.56662
Show Author Affiliations
David Mordo, AG Associates (United States)
Yuval Wasserman, AG Associates (United States)
Arnon Gat, AG Associates (United States)

Published in SPIE Proceedings Vol. 1595:
Rapid Thermal and Integrated Processing
Mehrdad M. Moslehi; Rajendra Singh; Dim-Lee Kwong, Editor(s)

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