Share Email Print

Proceedings Paper

Review of rapid thermal processing: system design and applications
Author(s): Xiao-Li Xu; Jim J. Wortman; Mehmet C. Ozturk; Furman Yates Sorrell
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Issues of rapid thermal processing (RTP) system design and process applications are reviewed. Temperature measurement is the most important and limiting factor in current RTP systems. Problems related to the temperature measurement and control and potential solutions are discussed. Process uniformity control is another important issue in RTP system design. Reactor chamber design, selection and arrangement of heat source, as well as issues related to dislocation generation, patterned and doped wafer, and ramp-up (down) thennal cycle are considered. Experimental results (RTO, RTCVD silicon nitride and polysilicon) based on an in-house RTP system developed in our laboratory are taken as examples to demonstrate the process applications and system requirements for single wafer processing.

Paper Details

Date Published: 1 February 1992
PDF: 17 pages
Proc. SPIE 1595, Rapid Thermal and Integrated Processing, (1 February 1992); doi: 10.1117/12.56659
Show Author Affiliations
Xiao-Li Xu, North Carolina State Univ. (United States)
Jim J. Wortman, North Carolina State Univ. (United States)
Mehmet C. Ozturk, North Carolina State Univ. (United States)
Furman Yates Sorrell, North Carolina State Univ. (United States)

Published in SPIE Proceedings Vol. 1595:
Rapid Thermal and Integrated Processing
Mehrdad M. Moslehi; Rajendra Singh; Dim-Lee Kwong, Editor(s)

© SPIE. Terms of Use
Back to Top