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Proceedings Paper

Etch process characterization using neural network methodology: a case study
Author(s): Michael T. Mocella; James A. Bondur; Terry R. Turner
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Paper Details

Date Published: 1 January 1992
PDF: 11 pages
Proc. SPIE 1594, Process Module Metrology, Control and Clustering, (1 January 1992); doi: 10.1117/12.56637
Show Author Affiliations
Michael T. Mocella, DuPont Electronics (United States)
James A. Bondur, Applied Materials, Inc. (United States)
Terry R. Turner, SEMATECH (United States)


Published in SPIE Proceedings Vol. 1594:
Process Module Metrology, Control and Clustering
Cecil J. Davis; Irving P. Herman; Terry R. Turner, Editor(s)

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