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Proceedings Paper

Dynamic design processing of integrated circuits for an "on target" end product
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Paper Abstract

As an extension to approaches in wafer processing, a new technique is being developed: Dynamic Design Processing. This technique is based on the recalculation of design specifications, whenever the results of any process step diverge specifications. These random divergences are inherent in any processing step. Recalculation of the design specification values restores the final performance of the device to the desired one. Simulation results show that applying this technique is practically equivalent to eliminating the process randomness.

Paper Details

Date Published: 1 January 1992
PDF: 6 pages
Proc. SPIE 1594, Process Module Metrology, Control and Clustering, (1 January 1992); doi: 10.1117/12.56624
Show Author Affiliations
Renate Sitte, Griffith Univ. (Australia)
Sima Dimitrijev, Griffith Univ. (Australia)
H. Barry Harrison, Griffith Univ. (Australia)


Published in SPIE Proceedings Vol. 1594:
Process Module Metrology, Control and Clustering
Cecil J. Davis; Irving P. Herman; Terry R. Turner, Editor(s)

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