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Proceedings Paper

Cluster tool technology
Author(s): John R. Hauser; Syed A. Rizvi
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Paper Abstract

A review is presented of cluster tool concepts, their potential advantages for future IC manufacturing, approaches to cluster tools and cluster tool technologies. As wafer size increases and device feature size decreases, cluster tools should play a more central role in future IC manufacturing, although there are several problems to be overcome before cluster tools are available for a broad spectrum of IC technologies.

Paper Details

Date Published: 1 January 1992
PDF: 10 pages
Proc. SPIE 1594, Process Module Metrology, Control and Clustering, (1 January 1992); doi: 10.1117/12.56620
Show Author Affiliations
John R. Hauser, North Carolina State Univ. (United States)
Syed A. Rizvi, Semiconductor Research Corp. (United States)


Published in SPIE Proceedings Vol. 1594:
Process Module Metrology, Control and Clustering
Cecil J. Davis; Irving P. Herman; Terry R. Turner, Editor(s)

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