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Proceedings Paper

Learning opportunities through the use of cluster tools
Author(s): Thomas E. Seidel; Michael R. Stark
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Paper Abstract

Future semiconductor manufacture includes challenging requirements to maintain film interface quality and minimize contamination. In addition, there will also be a drive to reduce costs by reducing the number of operational steps or by increasing throughput. Processes driven by yield considerations are metal stacks, poly-metal dielectric (cluster tools exist today) and, in the future perhaps, gate stacks, poly emitters, and salicide contacts. Processes driven to reduce operational expenses are those that are used many times, such as lithocells (track and exposure tools) and, perhaps, metrology cells. This paper reviews the status and process intent of typical cluster tools and their architectures. It addresses many of the issues that exist and provides a theme that much learning is required to achieve a substantial cluster tool environment in a future factory environment.

Paper Details

Date Published: 1 January 1992
PDF: 17 pages
Proc. SPIE 1594, Process Module Metrology, Control and Clustering, (1 January 1992); doi: 10.1117/12.56617
Show Author Affiliations
Thomas E. Seidel, SEMATECH (United States)
Michael R. Stark, SEMATECH (United States)

Published in SPIE Proceedings Vol. 1594:
Process Module Metrology, Control and Clustering
Cecil J. Davis; Irving P. Herman; Terry R. Turner, Editor(s)

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