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Proceedings Paper

Characterization of transfer-bonded silicon bolometer arrays
Author(s): Frank Niklaus; Johan Pejnefors; Matteo Dainese; Michael Haggblad; Per-Erik Hellstrom; Ulf J. Wallgren; Goran Stemme
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Paper Abstract

In this paper we present the design, fabrication and characterization of arrays of boron doped polycrystalline silicon bolometers. The bolometer arrays have been fabricated using CMOS compatible wafer-level transfer bonding. The transfer bonding technique allows the bolometer materials to be deposited and optimized on a separate substrate and then, in a subsequent integration step to be transferred to the read-out integrated circuit (ROIC) wafer. Transfer bonding allows thermal infrared detectors with crystalline and/or high temperature deposited, high performance temperature sensing materials to be integrated on CMOS based ROICs. Uncooled infrared bolometer arrays with 18x18 pixels and with 320x240 pixels have been fabricated on silicon substrates. Individual pixels of the arrays can be addressed for characterization purposes. The resistance of the bolometers has been measured to be in the 50 kΩ range and the temperature coefficient of resistance (TCR) of the bolometer has been measured to be -0.52%/K. The pixel structure is designed as a resonant absorbing cavity, with expected absorbance above 90%, in the wavelength interval of 8 to 12 μm. The measured results are in good agreement with the predicted absorbance values.

Paper Details

Date Published: 30 August 2004
PDF: 10 pages
Proc. SPIE 5406, Infrared Technology and Applications XXX, (30 August 2004); doi: 10.1117/12.565894
Show Author Affiliations
Frank Niklaus, Royal Institute of Technology (Sweden)
Johan Pejnefors, FLIR Systems AB (Sweden)
Matteo Dainese, FLIR Systems AB (Sweden)
Royal Institute of Technology (Sweden)
Michael Haggblad, Royal Institute of Technology (Sweden)
Per-Erik Hellstrom, Royal Institute of Technology (Sweden)
Ulf J. Wallgren, FLIR Systems AB (Sweden)
Goran Stemme, Royal Institute of Technology (Sweden)


Published in SPIE Proceedings Vol. 5406:
Infrared Technology and Applications XXX
Bjorn F. Andresen; Gabor F. Fulop, Editor(s)

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