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Proceedings Paper

Comparison of growth rate, roughness, and surface morphology of Cu and W thin films prepared by pulsed laser deposition
Author(s): Miroslav Michalka; Frantisek Uherek; Jaroslav Bruncko
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Paper Abstract

The aim of this study was to compare some differences between the growth rate, roughness and surface morphology of Cu and W layers. The growth of metal thin films was performed on silicon substrate. The layers were prepared by the pulsed laser deposition (PLD) using THG Nd:YAG laser at 355 nm. The number of laser pulses (time of deposition) varied from 1000 to 20000. The characteristics of the layers were examined using the methods of atomic force microscopy (AFM) and scanning electron microscopy (SEM). Results show that the growth rate of W is higher than Cu.

Paper Details

Date Published: 21 June 2004
PDF: 5 pages
Proc. SPIE 5449, Eighth International Conference on Laser and Laser Information Technologies, (21 June 2004); doi: 10.1117/12.563095
Show Author Affiliations
Miroslav Michalka, International Laser Ctr. (Slovak Republic)
Frantisek Uherek, International Laser Ctr. (Slovak Republic)
Slovak Univ. of Technology (Slovak Republic)
Jaroslav Bruncko, International Laser Ctr. (Slovak Republic)


Published in SPIE Proceedings Vol. 5449:
Eighth International Conference on Laser and Laser Information Technologies
Vladislav Ya. Panchenko; Nikola V. Sabotinov, Editor(s)

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