Share Email Print
cover

Proceedings Paper

High-density multimode photonic backplane
Author(s): Min-Yi Shih; Christoph Erben; Thomas Gorczyca; Samhita Dasgupta; Ernest Balch; Glenn Claydon; Todd Tolliver; Renato Guida; William Kornrumpf; Matthew Nielsen; Eric Breitung
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The development of a photonic backplane for high-speed and high-bandwidth communications is presented. This hybrid, multimode, multi-channel backplane structure contains both electrical and optical interconnects, suitable for next-generation high-speed servers with terabit backplane capacity. Removable and all-passively aligned high density interconnects on this backplane are achieved by polymer based optical waveguides with integrated micro-optics and VCSEL arrays on conventional printed circuit boards. The fabrication of this photonic backplane requires few additional steps outside a traditional board-manufacturing environment and is largely compatible with existing processes.

Paper Details

Date Published: 8 October 2004
PDF: 6 pages
Proc. SPIE 5515, Nanoengineering: Fabrication, Properties, Optics, and Devices, (8 October 2004); doi: 10.1117/12.560093
Show Author Affiliations
Min-Yi Shih, GE Global Research Ctr. (United States)
Christoph Erben, GE Global Research Ctr. (United States)
Thomas Gorczyca, GE Global Research Ctr. (United States)
Samhita Dasgupta, GE Global Research Ctr. (United States)
Ernest Balch, GE Global Research Ctr. (United States)
Glenn Claydon, GE Global Research Ctr. (United States)
Todd Tolliver, GE Global Research Ctr. (United States)
Renato Guida, GE Global Research Ctr. (United States)
William Kornrumpf, GE Global Research Ctr. (United States)
Matthew Nielsen, GE Global Research Ctr. (United States)
Eric Breitung, GE Global Research Ctr. (United States)


Published in SPIE Proceedings Vol. 5515:
Nanoengineering: Fabrication, Properties, Optics, and Devices
Elizabeth A. Dobisz; Louay A. Eldada, Editor(s)

© SPIE. Terms of Use
Back to Top