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Proceedings Paper

Packaging and characterization of micro-opto-electro-mechanical systems
Author(s): Ray Saupe; Thomas Otto; Volker Stock; Uwe Fritzsch; Thomas Gessner
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Paper Abstract

Modern optical analytics require more and more compact and cost-effective modules for analysis of surfaces, solids, thin films, powders, pastes, gels, liquids and alike. Thereby a fast and non-invasive measurement is often necessary. Microsystem technology, more precisely Micro-Opto-Electro-Mechanical System (MOEMS) technology is suitable for the realization of such modules. Different miniaturized optical analyzers employing MOEMS have been developed at the Fraunhofer Institute for Reliability and Microintegration (IZM) in collaboration with the Center for Microtechnologies (ZfM) and the company COLOUR CONTROL Farbmesstechnik GmbH. These devices are based on the principle of spectral sensing in the infrared range. Due to the requirement of compact dimensions and short optical paths a high packaging accuracy is necessary. In the development process different setups with a continuous packaging improvement have been realized. The first packaging principle was based on particularly assembled laser-cut stainless steel sheets and optical standard components. The design requires exact positioning of the functional elements to attain a sufficient optical resolution. The reduction of the active components by means of monolithic combinations was one improvement. Further progress could be achieved by a package made of aluminum cast, whose models were provided using modern methods of rapid prototyping. Consequently adjustment tolerances will be minimized and the vibration stability will be increased. During the development process, simulations and characterization of the system are essential to obtain necessary improvements. Thereby an evaluation of the packaging accuracy regarding its influence on the defocus was made. According to precision and reproducibility, the optical and electrical performance are being tested.

Paper Details

Date Published: 7 April 2004
PDF: 4 pages
Proc. SPIE 5445, Microwave and Optical Technology 2003, (7 April 2004); doi: 10.1117/12.558489
Show Author Affiliations
Ray Saupe, Technische Univ. Chemnitz (Germany)
Thomas Otto, Fraunhofer-Institut fuer Zuverlassigkeit und Mikrointegration (Germany)
Volker Stock, Technische Univ. Chemnitz (Germany)
Uwe Fritzsch, COLOUR CONTROL Farbmesstechnik GmbH (Germany)
Thomas Gessner, Technische Univ. Chemnitz (Germany)
Fraunhofer-Institut fur Zuverlaessigkeit und Mikrointegration (Germany)


Published in SPIE Proceedings Vol. 5445:
Microwave and Optical Technology 2003
Jaromir Pistora; Kamil Postava; Miroslav Hrabovsky; Banmali S. Rawat, Editor(s)

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