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Proceedings Paper

Bottom-emitting flip-chip VCSEL structure with reduced constraints on modulation response
Author(s): Ahmad N. Al-Omari; Stewart A. Feld; Kevin L. Lear
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Paper Abstract

Intrinsic and extrinsic limitations on conventional top-emitting high-speed VCSEL modulation bandwidth are discussed. A new VCSEL structure has been designed with reduced constraints on modulation bandwidth. The structure simultaneously addresses the primary extrinsic factors that limit the VCSEL modulation bandwidth. The new bottom-emitting, flip-chipped VCSEL structure improves heat-sinking, current injection uniformity, and reduces parasitic capacitance. We estimate the ultimate bandwidth of this new structure to be as high as 40Gb/s.

Paper Details

Date Published: 4 November 2004
PDF: 7 pages
Proc. SPIE 5556, Photonic Devices and Algorithms for Computing VI, (4 November 2004); doi: 10.1117/12.558041
Show Author Affiliations
Ahmad N. Al-Omari, Colorado State Univ. (United States)
Stewart A. Feld, Colorado State Univ. (United States)
Kevin L. Lear, Colorado State Univ. (United States)

Published in SPIE Proceedings Vol. 5556:
Photonic Devices and Algorithms for Computing VI
Khan M. Iftekharuddin; Abdul Ahad S. Awwal, Editor(s)

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