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Proceedings Paper

Extension of photolithography
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Paper Abstract

We will review the evolution of photolithography since its implementation in production of semiconductor IC devices. We will show how, at every forecast end of its existence, we have found new ways to prolong its life well beyond what was thought possible, and are now considering driving it to the limits of Physics. We will show how the development of new materials has, in almost all cases, been the enabling factor to implementation of new, lower wavelength photolithgraphies. We will discuss the factors driving the economics of lithography and how this has previously, and continues to have, a pivotal influence on which lithography technique is implemented into production. The likely limits of photolithography below 50nm resolution will be shown together with the factors likely to finally force us out of photolithography.

Paper Details

Date Published: 20 August 2004
PDF: 11 pages
Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); doi: 10.1117/12.557793
Show Author Affiliations
Masaomi Kameyama, Nikon Corp. (Japan)
Martin McCallum, Nikon Precision Europe GmbH (United Kingdom)

Published in SPIE Proceedings Vol. 5446:
Photomask and Next-Generation Lithography Mask Technology XI
Hiroyoshi Tanabe, Editor(s)

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