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Proceedings Paper

A photomask defect evaluation system
Author(s): Eiji Yamanaka; Shingo Kanamitsu; Takashi Hirano; Satoshi Tanaka; Takahiro Ikeda; Osamu Ikenaga; Tsukasa Kawashima; Syogo Narukawa; Hideaki Kobayashi
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Paper Abstract

Photomasks are currently inspected based on the standard of defect size. A shortcoming of this standard is that the type of defects which do not impact on a wafer, could be detected as impermissible defects. All of them are subject to repair works and some of them require further inspection by AIMS. This is one of the factors that are pushing down the yield and the turnaround time (TAT) of mask manufacturing. An effective way to improve this situation will be to do the repair works selectively on the defects that are predicted to inflict a functional damage on a wafer. In this report, we will propose a defect evaluation system named ADRES (Advanced Photomask Defect Repair Evaluation System), featuring a function to extract edges from a mask SEM image to be passed on to a litho-simulation. A distinctive point of our system is the use of a mask SEM image with a high resolution.

Paper Details

Date Published: 20 August 2004
PDF: 8 pages
Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); doi: 10.1117/12.557782
Show Author Affiliations
Eiji Yamanaka, Toshiba Corp. (Japan)
Shingo Kanamitsu, Toshiba Corp. (Japan)
Takashi Hirano, Toshiba Corp. (Japan)
Satoshi Tanaka, Toshiba Corp. (Japan)
Takahiro Ikeda, Toshiba Corp. (Japan)
Osamu Ikenaga, Toshiba Corp. (Japan)
Tsukasa Kawashima, Dai Nippon Printing Co., Ltd. (Japan)
Syogo Narukawa, Dai Nippon Printing Co., Ltd. (Japan)
Hideaki Kobayashi, Dai Nippon Printing Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 5446:
Photomask and Next-Generation Lithography Mask Technology XI
Hiroyoshi Tanabe, Editor(s)

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