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Proceedings Paper

A trial to quantify and classify process non-uniformity into baking and development
Author(s): Hideo Kobayashi; Tomohiro Shirane; Atsuo Imai; Keiji Tsukuda; Shoji Yamamoto
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Paper Abstract

The final reticle CD uniformity provides us with quantitative information but impracticable one to classify it into each step of the process. We then contrived a new method for quantifying process non-uniformity and classifying it into each of baking and development with properly utilizing resist behaviors in the process. We firstly tried to quantify baking non-uniformity by utilizing a resist behavior in coating film contraction to baking temperature. A resist film can be used just like a thermo-measuring device if the film contraction occurs significantly enough and linearly to baking temperature. Secondly, we tried to quantify development non-uniformity by utilizing a resist behavior in film dissolution by development. A resist film can be used as development speed-meter if the film reduction by the development occurs slowly enough and linearly. This paper describes a novel and convenient technique and its value to quantify process non-uniformity and classify it into resist baking and development.

Paper Details

Date Published: 20 August 2004
PDF: 16 pages
Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); doi: 10.1117/12.557715
Show Author Affiliations
Hideo Kobayashi, HOYA Corp. (Japan)
Tomohiro Shirane, MTC Co., Ltd. (Japan)
Atsuo Imai, MTC Co., Ltd. (Japan)
Keiji Tsukuda, TAZMO Co., Ltd. (Japan)
Shoji Yamamoto, TAZMO Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 5446:
Photomask and Next-Generation Lithography Mask Technology XI
Hiroyoshi Tanabe, Editor(s)

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