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Proceedings Paper

Investigation of sub-pellicle defect formation at KrF lithography
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Paper Abstract

In this study we investigated the defect due to pellicle frame materials for repeating exposure in months. Defects were found in the sub-pellicle and the defect density was high in the 4 corners compared to the center of the mask. The defects grew on MoSiON or the interface Quartz and MoSiON film, and the defect size was below 0.5 um. By analyzing with Raman Spectroscopy, defects consist of Ammonium Sulfates, Melamine Formaldade Resin and KClO3. The evaluation method for cleaning process and pellicles was Ion Chromatography. According to Ion Chromatography analysis, the main composition of defect was substances of pellicle frame materials. Also we confirmed the pellicle frame effect with the exposure test.

Paper Details

Date Published: 20 August 2004
PDF: 7 pages
Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); doi: 10.1117/12.557703
Show Author Affiliations
Junsik Lee, Hynix Semiconductor Inc. (South Korea)
Dong Wook Lee, Hynix Semiconductor Inc. (South Korea)
Mun-Sik Kim, Hynix Semiconductor Inc. (South Korea)
Ho-Yong Jung, Hynix Semiconductor Inc. (South Korea)
Oscar Han, Hynix Semiconductor Inc. (South Korea)

Published in SPIE Proceedings Vol. 5446:
Photomask and Next-Generation Lithography Mask Technology XI
Hiroyoshi Tanabe, Editor(s)

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