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Proceedings Paper

Improving photomask surface properties through a combination of dry and wet cleaning steps
Author(s): Florence O. Eschbach; Daniel Tanzil; Michael Kovalchick; Uwe U. Dietze; Min Liu; Fei Xu
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Paper Abstract

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Paper Details

Date Published: 20 August 2004
PDF: 9 pages
Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); doi: 10.1117/12.557700
Show Author Affiliations
Florence O. Eschbach, Intel Corp. (United States)
Daniel Tanzil, Intel Corp. (United States)
Michael Kovalchick, Intel Corp. (United States)
Uwe U. Dietze, STEAG HamaTech USA, Inc. (United States)
Min Liu, STEAG HamaTech USA, Inc. (United States)
Fei Xu, STEAG HamaTech USA, Inc. (United States)


Published in SPIE Proceedings Vol. 5446:
Photomask and Next-Generation Lithography Mask Technology XI
Hiroyoshi Tanabe, Editor(s)

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