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Proceedings Paper

0.13/0.15-µm production reticle process window qualification procedure for 200mm manufacturing fab
Author(s): Zih-Wen Chang; Chen-Ming Wu; Mabel Mo; Chin-Chung Shieh; D.S. Cheng; Chun-Chien Chen; Richard Y. Yang; David W. Randall; Wen-Cheng Yu
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Paper Abstract

The increasing complexity of Resolution Enhancements Techniques (RET) in optical lithography requires careful qualification of new reticle designs when they arrive at the wafer fab before commiting them to printing product. In order to qualify the reticle designs at the wafer level, process window qualification (PWQ) is performed by inspecting wafers printed with the reticles to be qualified. The output from the wafer inspection tool provides information on the regions of marginality within the reticle field or features within the die which can have a smaller than expected process window. tsmc Fab 6, an advanced high volume production foundry fab, uses an effective and efficient standardized PWQ procedure to qualify new incoming reticle designs described herein.

Paper Details

Date Published: 20 August 2004
PDF: 9 pages
Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); doi: 10.1117/12.557698
Show Author Affiliations
Zih-Wen Chang, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chen-Ming Wu, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Mabel Mo, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chin-Chung Shieh, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
D.S. Cheng, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chun-Chien Chen, KLA-Tencor Corp. (United States)
Richard Y. Yang, KLA-Tencor Corp. (United States)
David W. Randall, KLA-Tencor Corp. (United States)
Wen-Cheng Yu, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 5446:
Photomask and Next-Generation Lithography Mask Technology XI
Hiroyoshi Tanabe, Editor(s)

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