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Proceedings Paper

Process optimization using lithography simulation
Author(s): Andreas Erdmann
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Paper Abstract

Lithography simulation has become an indispensable tool for understanding and optimization of lithographic processes and for the development of new processes. Aerial image simulations are used to evaluate the imaging of designed photomasks by projection steppers or scanners and to explore the impact of optical parameters such as numerical aperture, spatial coherence, defocus, and wave aberrations on the imaging performance. Other simulation approaches are used to describe the impact of the photoresist thickness, of the post exposure (PEB) temperature, and of the development characteristics of the photoresist on the total process performance. This article reviews the most important modeling approaches which are used in lithography simulation. Several examples demonstrate the application of modern simulation tools for the optimization of lithographic mask and illumination geometries. This includes the application of genetic algorithms for global parameter optimization and the rigorous electromagnetic modeling of light diffraction from advanced lithographic masks.

Paper Details

Date Published: 28 May 2004
PDF: 15 pages
Proc. SPIE 5401, Micro- and Nanoelectronics 2003, (28 May 2004); doi: 10.1117/12.556987
Show Author Affiliations
Andreas Erdmann, Fraunhofer Institute for Integrated Systems and Device Technology (Germany)

Published in SPIE Proceedings Vol. 5401:
Micro- and Nanoelectronics 2003
Kamil A. Valiev; Alexander A. Orlikovsky, Editor(s)

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