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Proceedings Paper

Integration of multimode waveguides and micromirror couplers in printed circuit boards using laser ablation
Author(s): Geert Van Steenberge; Peter Geerinck; Steven Van Put; Peter Van Daele
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Paper Abstract

Integration of optical interconnections on a Printed Circuit Board (PCB) is very challenging, as it should remain compatible with existing PCB manufacturing technology based on laminated FR4-substrates and making use of solder-reflow and well-known placement and assembly techniques. In this paper we will describe different technologies being used for integration of such optical interconnections in PCB's. As we will demonstrate, the use of laser ablation, already used in PCB manufacturing for microvia's, is a suitable technique for the fabrication of multimode waveguides and micromirrors to provide optical coupling. Laser ablation is a very flexible technology that is particularly well suited for structuring of polymers because of their excellent UV-absorption properties and highly non-thermal ablation behavior. One of the most critical problems on the integration of optical interconnections in PCB's is coupling the light in and out of the optical plane. Because in our set-up the excimer laser beam can be tilted, the 45 degrees micromirrors can be easily fabricated using laser ablation. The focus is on ablation of waveguides using a frequency tripled Nd-YAG laser and on ablation of 45 degrees facets using a KrF excimer laser. It is shown that these structures can be defined in one single processing step, resulting in a very accurate alignment.

Paper Details

Date Published: 8 September 2004
PDF: 10 pages
Proc. SPIE 5454, Micro-Optics: Fabrication, Packaging, and Integration, (8 September 2004); doi: 10.1117/12.553066
Show Author Affiliations
Geert Van Steenberge, IMEC and Univ. Gent (Belgium)
Peter Geerinck, IMEC and Univ. Gent (Belgium)
Steven Van Put, IMEC and Univ. Gent (Belgium)
Peter Van Daele, IMEC and Univ. Gent (Belgium)


Published in SPIE Proceedings Vol. 5454:
Micro-Optics: Fabrication, Packaging, and Integration
Peter Van Daele; Juergen Mohr, Editor(s)

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