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Proceedings Paper

The study of the acrylic material drilling used by the CO2 laser
Author(s): Ming-Fei Chen; Yu-Pin Chen; W.-T. Hsiao
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Paper Abstract

Laser processing which used in the 3C industry is the new technology. The PCB (printed circuit board) Laser drilling is the new manufacturing process for the PCB industry. In this paper we report the results of an investigation exploring the feasibility of laser drilling microvias. The process relies on the use of pulses from a CO2 laser to drilling small holes in the panels of acrylic. There are two part of this paper, first we will drilling the small holes of the acrylic by the different parameter of the laser (pulse width, repetitive frequency, mask size and etc.). There are two result of this paper; first we find the repetitive frequency and mask size will be change the holes diameter and depth, and the pulse width will affect the quality of the drilling holes. In Addition we can find the optimal process parameter by this paper.

Paper Details

Date Published: 20 September 2004
PDF: 7 pages
Proc. SPIE 5448, High-Power Laser Ablation V, (20 September 2004); doi: 10.1117/12.549017
Show Author Affiliations
Ming-Fei Chen, National Changhua Univ. of Education (Taiwan)
Yu-Pin Chen, National Changhua Univ. of Education (Taiwan)
W.-T. Hsiao, National Changhua Univ. of Education (Taiwan)

Published in SPIE Proceedings Vol. 5448:
High-Power Laser Ablation V
Claude R. Phipps, Editor(s)

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